UV LED Solution
- 플립칩 패키징을 높은 열전도의 세라믹 PKG
- 높은 반사율
- 세미콘라이트의 혁신적인 플립칩 기술은 UVA에서 더 나은 반사율을 보여줍니다.
- Ag-free flip chip
- 3535 PKG, Wp ~400nm
- Power ~970mW@500mA
- Ag-free flip chip (35mil)
- 3535 PKG, 5000K, 80 Ra
- Efficacy~160 lm/Watt at 350mA
- Enhanced Thermal dissipation through Ceramic substrate (21 patents filed)
- Easy to implementation of multiple LED arrays in parallel and series configuration
- Scalability as to the consuming electrical power
- Compatible of package process using flip chip
- UV, Blue, Green, White
